COB light source is an integrated surface light source technology with high light efficiency, in which the LED chip is directly attached to the mirror metal substrate with high reflectivity.
COB light source characteristics:
1, cheap and convenient.
2. Electrical stability, scientific and reasonable circuit design, optical design and heat dissipation design.
3. Adopt heat dissipation technology to ensure that LED has industry-leading heat flow maintenance rate (95%).
4. It is convenient for the secondary optical matching of products and improves the lighting quality.
5, high color rendering, uniform luminescence, no light spot, health and environmental protection.
6. Simple installation and convenient use, which reduces the difficulty of lamp design and saves the cost of lamp processing and subsequent maintenance.
There are two main forms of extended data bare chip technology: one is COB technology, and the other is flip chip technology. Chip on board package (COB), in which a semiconductor chip is attached to a printed circuit board, and the electrical connection between the chip and the substrate is realized by wire stitching and covered with resin to ensure reliability.
COB Chip On Board (COB) technology firstly covers the silicon wafer attachment point with thermal conductive epoxy resin (generally epoxy resin mixed with silver particles) on the substrate surface, then directly attaches the silicon wafer to the substrate surface, and carries out heat treatment until the silicon wafer is firmly fixed on the substrate, and then directly establishes the electrical connection between the silicon wafer and the substrate through wire bonding.