Small size, miniaturization: electronic products have high assembly accuracy, small size and light weight. Compared with the traditional through-hole mounting technology, SMT can reduce the volume of electronic products by 60% and the weight by 75%.

Automatic production, high efficiency: smt automatic mounter adopts vacuum suction nozzle to mount components, which is helpful to improve mounting density and facilitate automatic production.

Save materials and reduce costs: in smt patches, the use area of pcb is reduced, components do not need to be shaped and trimmed in advance, and pcb circuit boards do not need to be punched, saving manpower and material resources, thus generally reducing production costs.

Quality can be effectively guaranteed: automatic production is adopted, the reliability of installation and welding is high, the general solder joint defect rate is less than 0.00 1%, and the quality can be effectively guaranteed.

Good high-frequency performance: Because chip components are firmly installed, there are usually no leads or short leads, which reduces the influence of parasitic inductance and capacitance, reduces electromagnetic interference and greatly improves the high-frequency characteristics of the circuit.

Disadvantages:

Similarly, SMT mounter will encounter various problems during processing, such as missing parts, side parts, turning parts, deviation, damaged parts and so on. It is necessary to analyze and manage various factors according to "people, machines, materials, law and environment" to improve the quality of mounting and reduce the corresponding defective rate.