SMT material refers to surface mounting technology (surface mounting
Technology), usually without pins or short leads, can be directly soldered to the surface of PCB or other substrates. SMT materials are small in size, can be produced automatically, improve production efficiency, reduce production costs and have high welding reliability.
DIP material refers to devices packaged by plug-ins, and the number of pins generally does not exceed 100. DIP materials are usually larger in size, stronger in vibration resistance and more stable than SMT materials. DIP material needs to be welded from the front to the back of PCB, generally by wave welding or manual welding.
The main difference between SMT material and DIP material lies in the packaging form and application scope. SMT materials are mainly used for surface mount technology, while DIP materials are mainly used for soldering plug-in electronic components. In addition, SMT materials are usually small and can be produced automatically, while DIP materials are usually large and need manual plug-ins or machine plug-ins.
When choosing whether to use SMT material or DIP material, it is necessary to comprehensively consider product requirements, production efficiency, cost and other factors.