First, dipping technology.

DIP package (dual in-line package), also known as dual in-line package technology.

Second, PFP people-friendly technology.

The Chinese meaning of QFP technology is called plastic square flat package.

PFP technology is called plastic flat packaging in English, which means plastic flat packaging in Chinese.

Third, PGA technology.

This technology is also called ceramic lead grid Arrau package. There are many square pins inside and outside the chip packaged by this technology, and each square pin is arranged at a certain distance around the chip, and 2 ~ 5 circles can be formed according to the number of pins. When installing, insert the chip into the dedicated PGA socket. In order to make the installation and disassembly of CPU more convenient, ZIF CPU socket has appeared since the 486 chip, which is specially used to meet the installation and disassembly requirements of PGA-packaged CPU. This technology is generally used in situations where plugging and unplugging operations are frequent.

The PGA package has the following characteristics:

1. The plug-in is more convenient and reliable to operate;

2. Adapt to higher frequencies;

3. If the ceramic substrate with good thermal conductivity is used, it can also meet the requirements of high-speed and high-power devices;

4. Because this package has pins protruding outward, it is generally plug-in installation rather than surface installation;

5. If ceramic substrates are used, the price is relatively high, so they are mostly used for special purposes. There are two types: display pin type and surface mount type.

Fourthly, BGA technology.

BGA (ball grid array package) is a technology of ball grid array package.