1, realizing miniaturization.
Electronic components processed by SMT chips are much smaller in geometric size and occupied space than through-hole plug-ins, which can generally be reduced by 60% ~ 70%, or even 90%. The weight is reduced by 60% ~ 90%.
2. The signal transmission speed is fast.
Compact structure and high assembly density, which can reach 5.5 ~ 20 solder joints /cm when mounted on both sides of the circuit board. Because of short connection and small delay, high-speed signal transmission can be realized. At the same time, it is more resistant to vibration and impact. This is of great significance to the ultra-high speed operation of electronic equipment.
3. Good high frequency characteristics.
Because the element has no lead or the lead is short, the distribution parameters of the circuit are naturally reduced and the RF interference is reduced.
4. It is beneficial to automatic production, and improves the yield and production efficiency.
Due to the standardization and serialization of SMT components and the consistency of welding conditions, the automation of SMT chip processing is very high, which greatly reduces the failure of components caused by welding process and improves reliability.
5, the material cost is low.
At present, except for a few varieties that are not easy to peel off or have high packaging accuracy, the packaging cost of most SMT components is lower than that of IFHT components of the same type and function, and the sales price of SMT components is lower than that of THT components.
6.SMT chip processing technology simplifies the production process of electronic products and reduces the production cost.
When assembling on PCB circuit board, the leads of components do not need to be shaped, bent and shortened, thus shortening the whole production process and improving the production efficiency. The processing cost of circuits with the same function is lower than that of through-hole insertion method, which can generally reduce the total production cost by 30% ~ 50%. SMT is a surface mount technology (abbreviated as Surface Mounted Technology), and it is the most popular technology and process in electronic assembly industry at present.