Led production process, the whole process of LED production process! 1.Microscopic inspection of LED chip: whether there is mechanical damage and pitting on the data surface (whether the chip size and electrode size of Lockhill meet the process requirements or whether the electrode pattern is complete) 2. Manual expansion can also be used when the LED chip spacing is stretched to about 0.6mm, because the LED chips are still closely arranged after dicing, and the spacing is very small (about 0. 1mm is beneficial to the operation of the next process. The film adhered to the chip is expanded by a film expander. But it is easy to cause bad problems such as chip falling and waste. 3.LED dispensing has red, yellow and yellow-green chips with opposite electrodes, and the corresponding positions of LED brackets are coated with silver glue or insulating glue. For GaA SiC conductive substrate. Use silver glue. For blue and green LED chips with sapphire insulating substrate, insulating glue is used to fix the chips. Colloid height and dispensing position have detailed technological requirements. The process difficulty lies in the control of dispensing quantity. The proofing, stirring and using time of silver glue are all matters that must be paid attention to in the process. Because silver glue and insulating glue have strict requirements on storage and use. 4.LED glue making is to apply silver glue to the counter electrode of LED with a glue making machine, which is the opposite of dispensing. Then put the LED with silver glue on the back on the LED bracket. The efficiency of dispensing is much higher than dispensing, but not all products are suitable for dispensing. 5. Place the LED bracket that punctured the LED manually under the fixture, and place the unfolded LED chip (with or without glue) on the fixture of the puncture table. Under the microscope, the LED chips are stabbed to the corresponding positions with a needle. Compared with automatic mounting, manual punching has an advantage that it is convenient to replace different chips at any time, and it is suitable for products that need to install multiple chips. 6. Automatic LED mounting: firstly, apply silver glue (insulating glue) on the LED bracket, and then suck the LED chip up with a vacuum nozzle to move. In fact, automatic mounting is a combination of two steps: gluing (gluing) and mounting chips. And then placed in the corresponding bracket position. In the process of automatic mounting, it is mainly necessary to be familiar with the equipment operation programming, and at the same time, to adjust the gluing and installation accuracy of the equipment. Bakelite nozzles should be used as far as possible to prevent damage to the appearance of LED chips, especially blue-green chips, because steel nozzles will scratch the current diffusion layer on the chip surface. 7.LED sintering needs temperature monitoring, and the purpose of sintering is to solidify silver paste. Prevent batch defects. The sintering temperature of silver paste is generally controlled at 65438 050℃ and the sintering time is 2 hours. It can be adjusted to 170℃ and 1 hour according to the actual situation. Insulation glue is generally 150℃ 1 hour. Don't open it at will in the middle. The sintering furnace shall not be used for other purposes, and the silver glue sintering furnace must be opened every 2 hours (or 1 hour) according to the process requirements, and the sintered products shall be replaced. Prevent pollution. 8.LED bonding completes the connection of internal and external leads of the product. The purpose of pressure welding is to lead the electrode to the LED chip. First, press the first point on the electrode of the LED chip. There are two bonding processes for LED: gold wire ball bonding and aluminum wire bonding. The picture on the right shows the process of aluminum wire crimping. Then pull the aluminum wire above the corresponding bracket, and press the second point to break the aluminum wire. The gold wire ball welding process is to burn a ball first and then press the first point, and other processes are similar. The arch wire shape of bonded gold wire (aluminum wire) mainly needs to be monitored in the process, and bonding is the key link in LED packaging process. Solder joint shape, tension. 9. number nine. LED sealant is made of epoxy resin and bracket. Ordinary LED can't pass the air tightness test. There are three kinds of LED packages: glue, potting and plastic packaging. Basically, the difficulties in process control are bubbles, lack of materials and black spots. This design is mainly about the choice of materials. 9. 1LED dispensing: because epoxy resin will thicken during use. White LED dispensing also has the problem of color difference caused by phosphor precipitation. Top LEDs and side LEDs are suitable for distribution packaging. Manual dispensing packaging requires a high level of operation (especially for white led, the main difficulty is to control the amount of dispensing. 9.2 After the LED is encapsulated with glue, insert it into the pressure welding LED bracket, and the lamp -LED is encapsulated in the form of encapsulation. The process of potting is to inject liquid epoxy resin into the LED molding cavity. After the epoxy resin is cured in the oven, the LED is taken out of the mold cavity for molding. 9.3LED molding and packaging: close the upper and lower molds with a hydraulic press and vacuum, and put the pressure-welded LED bracket into the mold. Put the solid epoxy resin into the inlet of the injection channel, and press it into the mold channel with a hydraulic ejector pin for heating. The epoxy resin enters each LED molding groove along the channel and cures. 10.LED curing and post-curing Generally, the curing condition of epoxy is 135℃, and curing refers to the curing of encapsulating epoxy. 1 hour Molding and packaging are generally carried out at 150℃ for 4 minutes. Post-curing is to completely cure epoxy resin and thermally age LED. Post curing is very important to improve the bonding strength between epoxy resin and PCB. The general condition is 120℃ for 4 hours. 1 1.LED bar cutting and dicing need a dicing machine to complete the separation work. Because LEDs are connected in production, they are not single. ) The LED of the lamp package adopts rib cutting, and the rib of the LED bracket is cut off. SMD-LED is a kind of PCB. 12.LED testing also classifies LED products according to customer requirements. Test the photoelectric parameters of LED and check the overall dimensions. 13.LED packaging will count and package the finished products. Ultra-bright LEDs need anti-static packaging. Led production process, the whole process of LED production process!