However, special gas (a small amount of methane) and air are used as process gases to form hydroxyl groups on the treated surface, thus achieving hydrophilic effect and greatly prolonging the timeliness.
Plasma surface treatment is a new technology, which can realize many functions, mainly ultra-clean cleaning, activation, etching and coating.
If we want to activate the silicon wafer to make it hydrophilic, we need to use high-power plasma cleaning machine for processing. At this time, the activation function is dominant and the timeliness can reach 1 month to half a year.
The most advanced plasma surface treatment technology is coating function. Adding nano-hydrophilic coating on the surface of silicon wafer will not affect the performance of silicon wafer itself. Finally, the timeliness of this treatment is permanent.
The advanced application of plasma treatment in wafer-level packaging is increasing day by day. As semiconductor device manufacturers further reduce the size and improve the reliability of packaged devices, plasma processors have been increasingly used in higher-level wafer-level packaging. Wafer plasma cleaning machine can handle wafers of various sizes, with large capacity and automatic processing.
Wafer cleaning plasma cleaning machine is used to eliminate the pollutants produced in the process of wafer-level equipment manufacturing or upstream assembly. In any case, cleaning products that remove fluorine, oxide or metal pollution will greatly improve the yield, reliability and performance of integrated circuits.
Slag removal is photoresist residue, which is still being developed and sometimes processed. Plasma treatment removes a small amount of resist evenly on the whole surface of the wafer before further treatment. Plasma cleaning machine plasma processing wafers can be used for batch stripping, and the materials include photoresist, oxide, amide etching and dielectric. The uniformity of etching rate is more than 97%, which can reach 65438 0 microns per minute. Stripping and etching processes can be used for wafer-level packaging, MEMS manufacturing and disk drive processing. Silicon wafer pretreatment plasma processor removes pollutants and oxidation to improve bonding rate and reliability. In addition, plasma cleaning machine also improves the adhesion between passivation layers of wafers to obtain micro-roughness.
Adhesion plasma treatment between UBM, BCB and UBM changed the morphology and wetting effect of wafer passivation layer. Polymer materials such as benzocyclobutene (BCB) and UBM are redistributed in the dielectric layer of the wafer. Plasma cleaning machine is used to change the initial passivation layer of silicon wafer to enhance its wettability. A typical method of forming the dielectric pattern of the redistribution layer includes patterning the dielectric redistribution material by a typical photolithography method. Plasma cleaning machine plasma cleaning wafer is a feasible alternative to dielectric patterning, and can avoid the traditional wet treatment.
By cleaning WLP holes, wafers are assembled on stacked chips, which usually produces residual products. By optimizing the structure with plasma, through holes can be processed without damaging the wafer surface. Plasma cleaning of indentation can improve indentation adhesion and indentation shear strength. Plasma cleaning machine can significantly improve the concave-convex shear strength by improving the concave-convex adhesion on the wafer surface. The punching materials include different components of solder and gold nails.