According to the query of ANALOGDEVICES, packaging line is a kind of production line that packages semiconductor chips into components that can be installed on circuit boards. The minimum configuration of the packaging line depends on the type, scale, complexity and quality requirements of the packaging, but generally speaking, the packaging line needs at least the following components:

Mounter: used to cut bare chips from the wafer and attach them to the packaged substrate or carrier.

Wire bonder: used to connect the electrode of the chip with the pin or pad of the package with gold wire or copper wire to form an electrical connection.

Molding machine: used to seal the packaged chip and pin with plastic or resin to protect the chip from the external environment.

Cutting machine: used to cut the packaged chips and pins from the substrate or carrier, and carry out shape trimming.

Tester: used to test the electrical performance and reliability of the packaged chip and check whether it meets the specification requirements.

The above is the minimum configuration of the packaging line, but according to the different packaging technology and process, other equipment may be needed, such as rewinding welding machine, ball grid array machine, marking machine, sorting machine, etc. With the development of packaging technology, the configuration of packaging line will be constantly updated and optimized to improve the quality and efficiency of packaging.