Plastic packaging mold is a kind of thermosetting plastic die-casting mold with fixed feed cavity, which is specially used for plastic packaging of integrated circuits, semiconductors and chips, and is used in conjunction with semiconductor device molding and plastic packaging machines.

The structure of plastic packaging mold is similar to that of injection mold, but it is not an injection mold.

Composition of plastic packaging mold

The basic components of plastic packaging mold are: mold box (including upper and lower embedded parts), mold base (including ejection system, supporting system, guiding and positioning system and resetting system) and accessories (including gating system, feeding frame, heating element and temperature measuring and controlling element, etc.). ).

Classification of plastic packaging molds

1. Single injection head packaging mold

2. Multi-injection head packaging mold