(1) structural aspect
①IPM consists of high-speed and low-power IGBT core, optimized gate drive circuit and fast protection circuit. That is, the module not only integrates IGBT power switching devices and driving circuits, but also has fault detection circuits such as overcurrent and overheating, which can protect IPM from damage even if the load is short-circuited or overheated.
(2) The complicated electrical connection has ingenious design, reasonable wiring, beautiful appearance, small volume and compact structure. Therefore, the wiring is greatly reduced and shortened, and the problem of distributed parameters of high-speed switching devices and driving circuits is well solved, thus obtaining higher technical indexes. At the same time, it also brings great convenience for users to install.
(3) Because the products are produced by power semiconductor module technology, they are basically produced by molds and automation equipment, with little interference from human factors and stable product quality. This product has great advantages in material cost, manufacturing cost and production scale. Compared with other forms of IPM, it has greater competitiveness and market advantages.
④ The main circuit adopts imported IGBT square chip and advanced chip support board, which has small module voltage drop, low power consumption, high efficiency and good power saving effect.
⑤ Using (DCB) ceramic copper clad laminate, the unique treatment method and special welding process ensure that the welding layer has no void and good thermal conductivity.
⑥ Imported special IC and SMD components are adopted, which greatly improves the intelligent control capability and ensures the reliability of the drive and control circuit.
⑦ The module is packaged with imported high thermal conductivity insulating silica gel, which meets the insulation, moisture-proof and thermal conductivity requirements of all chips in the main circuit. Epoxy resin is poured outside to realize the firm connection between the upper and lower shells and achieve high protective strength and airtight sealing.
⑧ The main circuit, the control circuit and the copper heat conduction bottom plate are insulated from each other, and the insulation withstand voltage is ≥ 2,500 V (rms) to ensure personal safety.
Pet-name ruby using advanced switching power supply manufacturing technology, through a unique method to achieve isolated output, meet the needs of the drive circuit, and ensure personal safety.
In addition, the control terminal is electrically isolated from the main circuit, so it is very convenient to connect modules in series and parallel at will, which creates conditions for manufacturing high-power control equipment.
(2) Drive and control performance.
① Fast switching speed. The IGBT chips in the module are all of high-speed type, and the driving delay is small, so the switching speed is fast and the loss is small.
② Low power consumption. The IGBT in the module has low turn-on voltage and fast switching speed, so the power consumption is small.
③ It has the function of quick short circuit protection. This module detects IGBT current in real time. When serious overcurrent or direct short circuit occurs, IGBT will be soft-turned off.
④ It has overheat protection function. The temperature sensor is mounted on the insulating substrate near the IGBT chip. When the substrate reaches the set temperature, the internal control circuit of IPM module will turn off the gate drive.
⑤ It has the function of grid-driven undervoltage lockout. If the gate drive voltage is too low, IGBT will enter the amplification area, and the internal control circuit of the module will turn off the gate drive.
⑥ Strong anti-interference ability. The optimized gate drive is integrated with IGBT, with reasonable layout and no external drive line.
⑦ There is no need to take anti-static measures.