DIP packaging (dual in-line packaging), also known as dual in-line packaging technology, is the simplest packaging method. Refers to an integrated circuit chip packaged in dual in-line form. Most small and medium-sized integrated circuits adopt this packaging form, and the number of pins generally does not exceed 100. The CPU chip in DIP package has two rows of pins, which need to be inserted into the chip socket in DIP structure.
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Similarities and differences between 1.SIP and DIP encapsulation
The module power supply in SIP and DIP packages are vertical pins, but the pins in SIP are only installed on one side. DIP pins are on both sides and installed vertically. Relatively speaking, the style of dipping bags will be stronger.
Second, the packaging process.
Because the pieces of silicon chips cut from the wafer come out of the factory, if they are not packaged, they are not convenient for transportation, storage, welding and use, and they are always affected by impurities, moisture and rays in the air, causing damage, which leads to circuit failure or performance degradation.
Take DIP as an example. After passing the test, the bare die drawn on the wafer is placed on the supporting and fixing substrate (there is also a layer of material with good heat dissipation on the substrate), and then the metal contacts on the bare die are connected with external pins by welding with a plurality of metal wires, and then the resin is buried and sealed with a plastic tube shell to form the whole chip.
Baidu encyclopedia -SIP encapsulation
Baidu encyclopedia -DIP package