IC is the abbreviation of Integrated Circuit (IC block), and its types are generally classified according to the packaging form of IC in the industry. Traditional ICs include SOP, SOJ, QFP, PLCC, etc. Now, newer integrated circuits include BGA, CSP, flip chip and so on. These parts types show different shapes due to different pin numbers and pin spacing. In this section, we will discuss them. (1), SOP (small outline package): the parts have feet on both sides, and the feet spread outward (commonly known as gull-wing pins).

(2) SOJ (low profile J-pin package): There are feet on both sides of the device, and the feet are bent to the bottom of the device (J-pin).

(3) QFP (Quadrilateral Flat Package): The four sides of the part have feet, and the feet of the part are spread outward.

(4) PLCC (Plastic Leadless Chip Carrier): Four sides of the part have feet, and the feet of the part are bent towards the bottom of the part.

(5) BGA (ball grid array): The surface of the part has no feet, and its feet are arranged in a spherical matrix at the bottom of the part.

(6) CSP (Chip SCAL Package): Part size package. In the industry, the address of IC generally adopts the format of "type+pin number", such as SOP 14PIN, SOJ20PIN, QFP 100PIN, PLCC44PIN, etc.