First, the connecting holes on the double panel (that is, the through-hole part of the metallization process) are welded by wire, and the protruding part of the tip of the connecting wire is cut off to avoid hurting the operator's hand. This is the preparation for connecting the plates.

Before formal welding, the following process sequence and essentials should be followed: (1) Devices that need to be molded should be processed according to the requirements of process drawings; That is, shape first and then hang it. After molding, the model surface of the diode should face upwards, and the length of two pins should not be inconsistent. For devices with polarity requirements? When inserting, be careful not to reverse the polarity. In particular, after the roller integrated block element is inserted, there can be no obvious inclination whether it is vertical or horizontal.

The power of soldering iron for welding is between 25-40W, and the welding head temperature should be controlled at about 242℃. If the temperature is too high, the head is easy to "die", and if the temperature is too low, the solder cannot be melted. The welding time should be controlled at 3 to 4 seconds.

In formal welding, the operation is generally carried out according to the welding principle of devices from short to high and from inside to outside, and the welding time should be controlled well. If the welding time is too long, it will burn out the devices on the copper clad laminate and the copper clad laminate circuit. Because it is double-sided welding, it is necessary to make a process frame for placing the circuit board, so as not to bias the devices below. After the circuit board welding is completed, a comprehensive inspection should be conducted to find out where there are missing plugs and welding. After confirmation, the redundant device pins of the circuit board should be trimmed and finally flow into the next process.