First, the characteristics are different.
1, TSSOP package: SOP with a height less than 1.27mm is assembled.
2.SSOP package: SOP with pin center distance less than1.27mm. ..
Second, the packaging methods are different.
1, TSSOP package: denser pins and smaller package size for the same function.
2.SSOP package: one of the surface mount packages, the leads are led out from both sides of the package in a gull-wing (L-shaped) shape.
Third, the use is different.
1, TSSOP package: it can be made into SD card, MiniSD card and CF card through SMD or integrated into different terminal products such as MP3/MP4 and mobile storage, which is flexible and changeable.
2.SSOP packaging: plastic packaging, widely used, mainly used in various integrated circuits.
Baidu encyclopedia -SOP package
Baidu encyclopedia -TSSOP