The whole process is divided into six parts: monocrystalline silicon wafer manufacturing, IC design, mask manufacturing, IC manufacturing, IC testing and packaging.

1, single crystal silicon wafer manufacturing

Monocrystalline silicon wafer is used to manufacture integrated circuits. The manufacturing process of monocrystalline silicon wafer mainly includes crystal pulling, cutting, grinding, polishing and cleaning.

2. Integrated circuit design

Integrated circuit design is mainly to design the circuit and transform the designed circuit into layout.

3, mask making

Mask manufacturing refers to converting the circuit layout designed by the integrated circuit design center into glass plates with the same scale or reduced scale.

4.IC manufacturing?

Integrated circuit manufacturing refers to the manufacture of integrated circuit chips on monocrystalline silicon wafers, and its processes mainly include etching, oxidation, diffusion/ion implantation, thin film chemical vapor deposition and metal sputtering. Companies with the above functions are generally called wafer foundries.

5.IC test?

Before the products are sold to customers, in order to ensure the quality of integrated circuits, it is necessary to test their functions before packaging (wafer point testing) or after packaging (final testing). ?

6.IC packaging?

Integrated circuit packaging refers to the packaging of integrated circuits after wafer spot testing, and its process mainly includes wafer cutting, chip bonding, wire bonding, plastic packaging, rib cutting and molding, coding, final testing, sorting and ribbon weaving. ?

Second, the chip resistor production process flow chart

The process has three basic operation steps: coating, installation and welding.

1, coating

Coating is to coat solder paste (or curing glue) on PCB. Paint-related equipment includes: printing machine and dispensing machine.

The equipment related to paint is printing machine and dispensing machine.

Coating equipment: precision screen printing machine, tubular multipoint stereo precision printing machine.

Step 2 increase

Installation is to install the device on the PCB.

Related equipment installer.

Mounting equipment: automatic mounter and manual mounter.

3. Reflow soldering:?

Reflow soldering is to heat the assembly board to melt the solder paste and realize the electrical connection between the device and the PCB pad.

Related equipment: reflow oven.

Three. Capacitor production process flow chart

1, raw material: the key part of ceramic powder batching (raw material determines the performance of MLCC); ?

2. Ball milling: passing through a ball mill (the ball milling time is about 2-3 days, so that the particle size of the porcelain material reaches micron level); ? 3, ingredients-all kinds of ingredients are mixed according to a certain proportion; ? 4. Slurry mixing: adding additives to mix the mixed materials; ?

5. Edge flowing: evenly coat the paste slurry on the film (the film is made of special materials to ensure smooth surface); ?

6. Printing the electrode: printing the electrode material on the paste slurry after flowing according to certain rules (the dislocation of the electrode layer is guaranteed by this process, and the sizes of different MLCC are guaranteed by this process); ?

7. Stacking: the printed electrode streams are stacked along the paste block according to different capacitance values to form a capacitor blank plate (the specific capacitance value is determined by different layers); ?

8. Lamination: Multilayer blanks can be closely combined; ?

9, cutting: cutting the blank plate into a single blank; ?

10, glue removal: remove the glue that binds the raw materials at a high temperature of 390 degrees Celsius; ?

1 1. baking: the ceramic powder is sintered into a ceramic material, and ceramic particles are formed at a high temperature of 1300 degrees Celsius (this process lasts for several days, and if the temperature is not well controlled during baking, the capacitor is easily brittle);

12. Chamfering: grinding off the edges and corners of the cuboid to expose the electrode and form chamfered ceramic particles; ?

13. End capping: erect the chamfered ceramic particles exposed from the electrode, seal the broken ends with copper or silver materials to form copper (or silver) electrodes, and connect and bond the electrode plates to form end capped ceramic particles (this process determines the capacitance); ?

14. end firing: put the capped ceramic particles into a high-temperature furnace, and sinter the copper (or silver) end electrode to make it closely contact with the electrode plate; Forming a ceramic capacitor precursor; ?

15. Nickel plating: electroplate a thin nickel layer on the electrode end (copper end or silver end) of the primary body of the ceramic capacitor, and the nickel layer must completely cover the electrode end copper or silver to form the secondary body of the ceramic capacitor (this nickel layer is mainly due to the mutual penetration of the shielding electrode copper or silver and the outermost tin, resulting in the aging of the capacitor); ?

16. Tin plating: a layer of tin is plated on the nickel-plated ceramic capacitor sub-body to form the ceramic capacitor body (tin is an easy-to-weld material, and the tin plating process determines the solderability of the capacitor); ?

17. test: four indicators that must be tested in this process: withstand voltage, capacitance, DF loss, leakage current Ir, insulation resistance Ri (this process distinguishes the withstand voltage value of the capacitor from the accuracy of the capacitor, etc.). )?

Extended materials:

What is the basic symbol of the flow chart?

1. The difficulty in designing the flow chart lies in a clear grasp of the business logic. Familiar with all aspects of the whole process. This requires the designer to design the process of any activity or event himself, and analyze the activity and event itself in advance to study its inherent attributes and laws.

On this basis, grasping the links and time sequence of process design, scientifically designing the process and studying the inherent properties and laws are the basic factors that should be considered in process design. ? It is also the premise of designing a good flow chart.

2. According to the inherent properties and laws of things, the whole process of the process is decomposed into several small links according to the different functions of each stage, and each link can be represented by a process. In the flow chart, the flow is represented by box symbols.

3. Since it is a process, every link will have an order. According to the time sequence of each link, the links will be arranged in turn and connected by arrow lines. ? The arrow line indicates the progress of each link and step in the sequence in the flowchart. According to the need, you can briefly comment on the link inside or outside the box, or you can not comment it. ?

4. Conventional judgment is very important. Used to indicate a judgment or bifurcation point in the process. The description of judgment or bifurcation is written in a diamond, and often appears in the form of a question. The answer to this question determines the route drawn by the judgment symbol, and each route is marked with the corresponding answer.

References:

Baidu Encyclopedia-Flowchart Analysis Method