Firstly, epoxy adhesive is selected to bond the sheet-like workpiece to the free flat plate. The flat plate is placed on the magnetic chuck together with the thin plate. After grinding one end face of the wafer, the wafer workpiece is removed from the flat plate, the ground face is placed on the magnetic chuck, and then the other end face of the wafer workpiece is ground. Because epoxy resin has fluidity before hardening, it can fill the gap between thin workpiece and flat plate. When the epoxy resin hardens, the workpiece and the flat plate are bonded together to form a whole, and the rigidity of the workpiece is greatly enhanced. Under the attraction of magnetic force, the thin plate workpiece will not be clamped and deformed, which provides a clear condition for grinding the plane. Thick grease can also be used instead of epoxy resin to fill the gap between the thin workpiece and the magnetic chuck, so as to enhance the rigidity of the workpiece and obtain excellent results.
2. When grinding the thin workpiece on the surface grinder, select the elastic clamping device to position and clamp the thin workpiece in a free state. Put a layer of rubber with a thickness of 0.5 mm between the workpiece and the magnetic workbench. When the workpiece is attracted by magnetic force, the rubber is compressed and the elastic deformation becomes smaller. At this time, the plane of the workpiece can be ground. Repeated grinding can meet the requirements of machining accuracy.
Thirdly, the thin workpiece is clamped by atmospheric pressure for grinding.
Fourthly, use the flat-faced pliers in the accessories of the surface grinder to suck the thin workpiece through the magnetic workbench. Because the flat-nose pliers have a certain height, the magnetic force on the jaws is small. Choose the method of gradually reducing the feed rate, smooth one plane of the film workpiece, and then remove it. At this time, put the ground plane on the magnetic workbench, and then grind the other plane of the film workpiece for several times to make the flatness of the two planes meet the requirements.