1, additive process additive process refers to the process of directly growing local conductor lines with chemical copper layer on the surface of non-conductor substrate with the aid of external inhibitors (see page 62 of the 47th issue of the Journal of Circuit Board Information for details). The addition process for circuit boards can be divided into full addition, semi-addition and partial addition. 2. Backplane support board is a thick circuit board (such as 0.093 ",0. 125"), which is specially used for plugging other boards. The method is to insert the multi-pin connector into the emergency through hole without soldering, and then connect the wires one by one in a winding way on each guide pin where the connector passes through the board. The universal circuit board can be inserted into the connector separately. Because the through hole of this special plate can't be welded, but the hole wall is directly clamped by guide pins, the requirements on quality and aperture are particularly strict, and the order quantity is not large. General circuit board factories are unwilling and difficult to accept such orders, and it has almost become a high-end specialized industry in the United States. 3. This is a new field of thin multilayer board practice. The earliest inspiration came from IBM's SLC process, which was put into trial production in its Yasu factory 1989. This method is based on the traditional double panels, and liquid photosensitive precursors such as Probmer 52 are completely coated from two external panels. After semi-hardening and photosensitive decomposition, a shallow "light through hole" communicating with the next bottom layer is made, and then the conductor layer is comprehensively increased by electroless copper plating and electroplating. After line imaging and etching, new wiring and buried holes or blind holes interconnected with the bottom layer can be obtained. Repeatedly adding layers in this way will obtain the required number of layers for the multilayer board. This method can not only avoid expensive mechanical drilling costs, but also reduce its aperture to below 10mil. In the past 5 ~ 6 years, with the continuous promotion of manufacturers in the United States, Japan and Europe, various multilayer technologies that break the tradition and adopt layer-by-layer technology have made these laminated processes famous, and more than ten products have been listed. In addition to the above-mentioned "photosensitive pore-forming"; After removing the copper skin from the hole, the organic plate has different "pore-forming" methods, such as alkaline chemical etching, laser ablation and plasma etching. Moreover, a new type of resin-coated copper foil coated with semi-hardened resin can be used to make thinner, denser, smaller and thinner multilayer boards by sequential lamination. In the future, diversified personal electronic products will become the world of this really thin and short multilayer board. 4. Cermet Tao Jin: Ceramic powder and metal powder are mixed, and then adhesive is added as a coating, which can be printed on the surface (or inner layer) of the circuit board as a "resistor" to replace the external resistor during assembly. 5. Co-firing firing is a process of ceramic hybrid circuit board. The circuit printed with various precious metal thick film pastes on the surface of the small board is fired at high temperature. Various organic carriers in the thick film paste are burned off, leaving precious metal wires as interconnection lines. 6. When the crossing lines cross, it is called the three-dimensional crossing of vertical and horizontal wires on the crossing board, and the gap between the crossing points is filled with insulating medium. Generally, it belongs to this kind of "crossing" to add carbon film jumpers on the green paint surface of a single panel, or to wire up and down by adding layers. 7. Discrete wiring board, another way of saying multi-wiring board, is to connect round enameled wires to the board surface and add through holes. The performance of this kind of multi-line board in high frequency transmission line is better than that of flat square circuit etched by general PCB. 8.DYCOstrate plasma etching is an accumulation process developed by Dyconex Company in Zurich, Switzerland. First, the copper foil at each hole on the board is etched, then it is placed in a closed vacuum environment, filled with CF4, N2 and O2, and ionized under high pressure to form a highly active plasma, which is used to etch the substrate at the hole, and tiny vias (below 10mil) appear. Its commercialization process is called DYCOstrate. 9. Electrodeposition of photoresist. Electrophoretic photoresist is a new type of "photoresist" construction method, which was originally used for "electro-coating" of metal objects with complex shapes, and only recently was the application of "photoresist" introduced. The charged colloidal particles of photosensitive charged resin were uniformly plated on the copper surface of the circuit board as an etching resist by electroplating. At present, it has been used in batch production in the direct copper etching process of inner plate. According to the different operation methods, this kind of ED photoresist can be placed on the anode or cathode respectively, which is called "anode electrostatic photoresist" and "cathode electrostatic photoresist". According to the different photosensitive principles, it can be divided into "photosensitive polymerization" (negative work) and "photosensitive decomposition" (positive work). At present, the negative ED photoresist has been commercialized, but it can only be used as a planar photoresist, and the through hole cannot be used for image transfer of the outer plate because of the difficulty in photosensitive. As for the "positive ED" which can be used as the photoresist of the outer plate (because it belongs to the photolysis film, the hole wall is not sensitive enough, but it does not affect it), Japanese manufacturers are still stepping up their efforts, hoping to launch commercial mass production and make the production of thin lines easier. The word is also called "electrophoretic photoresist" 10, flush conductor embedded circuit, flat conductor is a special circuit board with flat surface, and all conductor circuits are pressed into the board. The method of single board is to etch off part of copper foil on semi-cured substrate by image transfer method to get the circuit. Then the circuit board is pressed into a semi-hardened board by high temperature and high pressure, and the hardening operation of the board resin can be completed at the same time, and the circuit board is completely flat when the circuit is retracted to the surface. Usually, it is necessary to etch off a thin copper layer on the surface of the circuit that has been shrunk, and then plate it with a nickel layer of 0.3 mil, a rhodium layer of 20 microinches or a gold layer of 10 microinches, so that the contact resistance can be lower and it is easier to slide when making sliding contact. However, this method is not suitable for PTH, so as to avoid crushing the through hole when pressing in. Moreover, this kind of plate is not easy to reach a completely smooth surface and cannot be used at high temperature to prevent the circuit from being pushed out of the surface after the resin expands. This technology is also called etching and pushing method, and its finished board is called embedded board, which can be used for special purposes, such as rotating switches and wiping contacts. 1 1, fritted glass fritted thick film (PTF) slurry, in addition to precious metal chemicals, also needs to add glass powder, in order to play a cohesive role in high-temperature melting, so that the slurry can form a solid precious metal circuit system on the green ceramic substrate. 12, total addition process The total addition process is a method of growing selective circuits on the surface of completely insulated boards by electroless metal deposition (mostly chemical copper), which is called "total addition process". Another incorrect statement is "no electricity at all". 13, hybrid integrated circuit hybrid circuit is a kind of circuit printed on a small ceramic thin substrate with precious metal conductive ink, and then the organic matter in the ink is burned at high temperature, leaving a conductor circuit on the board surface, which can be used for welding parts with bonded surfaces. It is the circuit carrier between printed circuit board and semiconductor integrated circuit device, and belongs to thick film technology. Early used in military or high frequency applications. In recent years, due to its high price, decreasing military use, increasing difficulty in automatic production, and miniaturization and precision of circuit boards, the growth of this hybrid has been greatly inferior to that of its early years. 14. Interposer interconnection conductor refers to any two layers of conductor carried by an insulating object, and some conductive fillers are filled in the place to be conducted, which is called interposer. For example, the bare hole of multilayer board is filled with silver paste or copper paste instead of the orthodox copper hole wall, or the vertical unidirectional conductive adhesive layer and other materials belong to this kind of adapter board. 15, laser direct imaging, LDI laser direct imaging is to directly scan the dry film on the plate for image transfer without exposing the negative film, instead of guiding the laser beam through the computer. Because it emits a single beam of parallel light with concentrated energy, the sidewall of the developed dry film can be made more vertical. However, this method can only work independently for each board, so the speed of mass production is far less than that of using negative film and traditional exposure. LDI can only produce 30 medium-sized boards per hour, so it can only occasionally appear in prototype proofing or high unit price boards. Because of the high innate cost, it is difficult to promote it in the industry. 16, there are many precision machining in laser processing electronics industry, such as cutting, drilling, welding, welding and so on. It can also be carried out by the energy of laser, which is called laser processing. The so-called laser refers to the abbreviation of "amplified stimulated emission of radiated light", which is translated as "laser" by mainland industry, which seems to be more appropriate than transliteration. The laser was made by American physicist T.H.Maiman in 1959, which used a single beam of light to irradiate the ruby. Years of research have created a brand-new processing method. Not only in the electronics industry, but also in the medical and military fields. 17. Micro-sealing wire (sealing wire) of micro-wire board The round-section enameled wire (adhesive sealing wire) attached to the board surface is a special circuit board that completes the interconnection between layers by making PTH, commonly known as "multi-wire board" in the industry. When the wiring density is high (160 ~ 250 in/in2), the wire diameter is very small (20. 18, Molded Circuit Molded three-dimensional circuit boards use three-dimensional molds, and the process of three-dimensional circuit boards is completed by injection molding or transformation, which is called molded circuits or molded interconnection circuits. The picture on the left shows the MIC diagram of two injections. 19. Multi-terminal board (or discrete terminal board) refers to a multi-layer interconnected circuit board made of extremely fine enameled wires, directly laid on a board without copper foil, and fixed by gluing, drilling and electroplating, which is called "multi-terminal board". The product was developed by PCK company in the United States and is still being produced by Hitachi company in Japan. This MWB can save design time and is suitable for a small number of models with complicated circuits (there is a special article in PCB Information Magazine No.60). 20. Precious metal paste is a conductive paste used for thick film circuit printing. When it is screen printed on a ceramic substrate, and then the organic carrier in it is burned off at high temperature, a fixed precious metal circuit appears. The conductive metal powder particles added to the slurry must be precious metals to avoid oxide formation at high temperature. Users of commodities include gold, platinum, rhodium, palladium or other precious metals. 2 1, in the early times of Pads Only board, in order to ensure the solderability and circuit safety of some high-reliability multilayer boards, only through holes and solder rings were left outside the board, and the interconnection circuits were hidden in the next inner layer. This kind of board with two more layers will not be printed with solder-proof green paint, and it is particularly particular about appearance and strict in quality inspection. At present, due to the increase of wiring density, many portable electronic products (such as mobile phones) only leave SMT pads or a few lines on the surface of the circuit board, but bury many interconnected dense wires in the inner layer, and use difficult blind holes or "pads on holes" as interconnections to reduce the damage of all-through holes to the grounding and voltage copper surfaces. This SMT dense board also belongs to the backplane type. 22. Polymer thick film (PTF) thick film paste refers to thick film circuit boards with ceramic substrates, precious metal paste used for manufacturing circuits, or paste used for forming printed resistance films. Its process includes screen printing and subsequent high-temperature incineration. After the organic carrier is burned, a firmly attached circuit system appears, which is commonly called hybrid circuit. 23. Semi-additive process The Semi-Additive Process refers to the process of directly growing the required circuit on the surface of the insulating substrate by electroless copper plating, and then continuing to thicken it by electroplating copper, which is called "semi-additive". If all the circuit thicknesses are made by electroless copper plating, it is called "total addition" process. Note that the above definition comes from the latest specification IPC-T-50E released in June 1992.7, which is different from the original IPC-T-50d (1988.11). Both the early version of "D" and the general view in the industry refer to the bare non-conductor substrate or the existing thin copper foil (such as 1/4 oz or 1/8oz). Firstly, the image transfer of negative resist is prepared, and then the required lines are thickened by electroless copper plating or electroplating. The new 50E does not mention the word "thin copper skin", and there is a big gap between the two statements. It seems that readers should follow the progress of the times in concept. 24. Subtractive process reduction method refers to the method of removing some useless copper foil on the surface of the substrate to obtain a circuit board, which is called "reduction method" and has been the mainstream of circuit boards for many years. It is just the opposite of another "adding process", that is, adding copper wires directly on the copper-free substrate. 25. Thick film circuit Thick film circuit is a circuit system with metal conductor, which is called "thick film circuit", by printing the "PTF PolymerThick FilmPaste" containing precious metal components on a ceramic substrate (such as alumina) and then firing it at high temperature. Belonging to a small "mixed circuit" board. The "silver paste jumper" on single-sided PCB also belongs to thick film printing, but it does not need high temperature firing. The circuit printed on the surface of various substrates can only be called "thick film" circuit if its thickness is above 0. 1 mm [4mil]. The manufacturing technology of this "circuit system" is called "thick film technology". 26. Thin film technology refers to the conductor and interconnection circuit attached to the substrate, and its thickness is below 0. 1 mm [4 mil]. It can be made by vacuum evaporation, pyrolysis coating, cathode sputtering, chemical vapor deposition, electroplating and anodic treatment, which is called "thin film technology". Practical products include thin film hybrid circuits and thin film integrated circuits. 27. The voltage conversion circuit of transfer laminated circuit is a new production method of circuit board. It uses a smooth stainless steel plate with a thickness of 93 mils, and the pattern of negative dry film is transferred first, and then the circuit is plated with copper at high speed. After peeling and drying the film, the surface of stainless steel plate with circuit can be pressed on the semi-hardened film at high temperature. After the stainless steel plate is peeled off, the embedded circuit board with flat surface can be obtained. Subsequently, it can be drilled and electroplated to obtain interlayer interconnection. CC-4 copper complex 4; It is a full addition process developed by PCK company in the United States (see PCB Information Magazine No.47 for a special introduction). Electrostatic photoresist IVH intermittent through hole; Local interlayer vias (buried and blind holes, etc.). ) MLC multilayer ceramics; Small board ceramic multilayer circuit board PID photosensitive medium; Photosensitive medium (refers to the photosensitive plate coated by lamination method) PTF polymer thick film; Polymer thick film circuit chip (refers to a thin circuit board printed with thick film paste) SLC surface lamp circuit; The surface thin-layer circuit is a new technology published by IBM Yasu Laboratory in June 1993. It is a multi-layer interconnection circuit formed by coating green paint and electroplating copper on the outer side of the double-panel board, and there is no need to drill holes and electroplate on the board.

For more information about project/service/procurement bidding, and to improve the winning rate, please click on the bottom of official website Customer Service for free consultation:/#/? source=bdzd