I/O terminals of BGA package are distributed under the package in the form of circular or columnar solder joints in the array. The advantage of BGA technology is that although the number of I/O pins has increased, the pin spacing has not decreased, thus improving the assembly yield. Although the power consumption is increased, BGA can be welded by controlled chipping method to improve its electrothermal performance. The thickness and weight are lower than those of the previous packaging technology; Parasitic parameters (which will cause output voltage disturbance when the current changes greatly) are reduced, the signal transmission delay is small, and the use frequency is greatly improved; * * * It can be assembled by surface welding with high reliability. BGA package is welded between CPU and motherboard and cannot be replaced.

As shown in the figure below:

The full name of LGA is Land Grid Array, which literally translates into grid array packaging, which corresponds to the packaging technology Socket 478 before Intel processor, also called Socket T. The reason why LGA is called "leap-forward technological revolution" is mainly because it replaces the previous needle pins with metal contact packaging. LGA775, as the name implies, has 775 contacts.

? Because it has changed from a pin to a contact, the processor of LGA775 interface is also different from the current product in installation mode. It does not use pins to fix the contacts, but needs a mounting bracket to fix them, so that the CPU can correctly press on the elastic tentacles exposed by the socket. Its principle is the same as BGA package, except that BGA is soldered, and LGA can untie the bracket and replace the chip at any time.

As shown in the figure below: