In 202 1 year, the flash memory gradually transited from 96 layers to 128 layers, and then to 170 layers to 200 layers. The scheme of each flash memory manufacturer is different. Western Digital will mass-produce BiCS6 generation 3D flash memory at the end of next year, with the number of stacks increased to 162 and the interface speed doubled.

In the flash memory market, Western Digital cooperated with Toshiba in R&D. In fact, BiCS technology mainly comes from Toshiba. At present, the main force of mass production is BiCS5, which was released in February 2065438+2009, with 1 12 stack, 5 12Gbit core capacity and 1.066Gbps interface speed.

BiCS6 flash memory is the next generation product. The number of stack layers is finally determined as 162, instead of 170+, and the core capacity is also increased to 1Tbit.

In addition, the interface speed will reach 2.0Gbps, which is twice that of the previous generation, but it is still a little far from the 2.4Gbps of Samsung's latest 8-generation V-NAND flash memory.

According to the plan of Western Digital, BiCS6 flash memory will be produced early next year.

But the real mass production will not be until the end of 2022.

, the current BiCS5 flash memory has to transition for at least one year.