The reason why the IC pin is soldered is that the inner diameter of the pad is too large or the outer diameter of the component pin is too small. In order to solve this problem, some treatments can be done before soldering, such as filling the gap between pads with appropriate solder wire, or adjusting the pad design to adapt to the pin size of the component. This can ensure the reliability and stability of welding and avoid poor welding or broken wires. In the process of IC bare foot welding, we should pay attention to the selection of appropriate welding technology and materials to ensure the welding quality and reliability.