IPC-A-6 10, Acceptability of electronic assembly, as a standard of electronic assembly, is widely accepted, with emphasis on solder joints. In February, 2005, IPC released the long-awaited updated version: IPC-A-610d. IPC-A-610 has a supporting document: ANSI/J-STD-00 1, requirements for welding electrical and electronic assembly. J-STD-00 1 establishes the minimum acceptable requirements for soldering electronic components. IPC-A-5 10 explains the requirements established in J-STD-00 1 with pictures. Other topics related to work quality, such as treatment methods and mechanical assembly, are also provided. IPC-A-6 10 can be used as an independent file, but it does not include topics such as inspection frequency or the number of allowed process indicators. These topics are contained in J-STD-00 1. Several partner documents focus on design, IPC-A-6 10 and J-STD-00 1: IPC-SM-782, Surface Mount Pad Graphics; IPC-222 1, general standard for printed board design; And IPC-2222, the local standard for rigid PWB design. If the design does not follow these documents, the important requirements established by IPC-A-6 10 and J-STD-00 1 cannot be applied, because the formation of solder joints is directly affected by the layout design of solder pads. If the pad layout is very different from IPC-SM-782, the solder joint shape defined by IPC-A-6 10 cannot be realized. IPC-A-600, the acceptability of printed circuit boards, is another important cooperation document. The original reason for updating IPC-A-6 10 D is to clarify the existing requirements and add new technologies. Nevertheless, when the working group started the revision process, they found some conflicts between J-STD-00 1 and IPC-A-6 10. The group decided to spend more time to correct these conflicts by modifying J-STD-001(version C was released in March 2000), which will bring benefits to the electronic manufacturing industry. These improvements will reduce misunderstandings, increase understanding and reduce the amount of training required to correctly interpret these documents. IPC process standard contains some basic concepts, some of which are briefly discussed here. For more specific or detailed information, please refer to IPC-A-6 10 and J-STD-00 1. Classification. Three kinds of products have been established: the first kind, general electronic products, aimed at consumer appliances; The second category, excellent service electronic products, is aimed at commercial appliances; The third category, high-performance electronic products, is aimed at those application products with serious failures. Target conditions. It is basically a desirable condition (usually called "priority"). It is ideal and almost perfect, but it is not absolutely necessary to ensure reliable operation and performance in the target use environment (category 1, 2 or 3). Acceptable conditions. Ensure reliable operation and performance in the target use environment. But it is not perfect, nor is it ideal. Defective state. That is, it may not be enough to ensure reliable operation and performance in the target use environment. Process indicator condition. I.e. alarm state, not fault. All conditions are sufficient to ensure reliable operation and performance in the target use environment. However, when the process indicators show abnormal changes or unexpected trends are found, the process must be analyzed to reduce the changes. In the D version, the titles of paragraphs and clauses have been carefully scrutinized, so the table of contents is easy to browse and the search is increased. The paragraphs were renumbered from 10 to 12, and the general format was changed to make it easier for users to use. Acceptability statements that do not contain visual references have been deleted or changed to introductory comments. English metric system was added to coordinate the established IPC file policy. The metric system is the main measurement method, and the English system is in brackets. Some changes, additions and deletions in version D are listed below: Electrostatic Discharge Control (ESD). ANSI/ESD-20.20 issued by ESD Association is now recommended as the original file of ESD information. Minimum electrical clearance. It is difficult to understand the statement that it does not conflict with the minimum electrical clearance. This is clarified by stating that "too much solder or pin protrusion may reduce the gap". IPC-222 1 6.3 is added as an appendix to help evaluate the minimum electrical gap. Thickness of solder fillet. Dimension G, the thickness of the solder leg, changed all the endpoints and classification, "showing good wet melting evidence". Locking adhesive (locking adhesive). When the vertical glue accumulation in the terminal area is visible, the first and second types of process indicators are acceptable, but the solder joint connection meets the minimum requirements. For the third category, when any glue is visible on the terminal, it is a defect. Chip element, secondary terminal. When there is obvious tail suspension B in the Y-axis direction, it is a defect for any one. The width c of the tail welding point is changed to 75% of w or p, whichever is the smallest. Chip assembly, rectangular or square end. The side length d and the minimum fillet height f (type 2) of the solder joint are changed to "Require proper wet fillet". Cylindrical end cap terminal. The tail lap joint J is changed to 1 and 50% for Class 2 and 75% for Class 3. Flat ribbon, L-shaped and gull-wing leads. For class 1, the minimum weld side length d is changed to include the minimum culvert side length of 0.5mm; Added information about how to measure the length of side solder joints in categories 2 and 3. It requires the length of the side solder joint to be at least 75% of the length L of the lead. The maximum heel fillet height e defines the terms of high and low profile of components, deletes the standard that conflicts with the minimum electrical gap, and is uncertain whether it is suitable for melting wet. For all categories, the minimum root fillet height f should extend to the midpoint of the toe-down shape of the outer pin bending. Round or flatten the lead. The explanation of the maximum fillet height e eliminates the confusion of the high/low profile of enemy components. For all categories, the minimum heel fillet height f should extend at least to the midpoint of the toe-down external pin bending. J-lead. Deleted the statement that "due to design reasons, pins with fusible wet edges are missing, and side fillets are not needed". Butt or I-joint. The maximum fillet height e is used to eliminate the confusion of high/low profile terms of components, and the standard of No.42 alloy pin is deleted. Installation deviation of chip components. For categories 1 and 2, side mounting is acceptable, while category 3 is not. For 1 grade, it is acceptable to attach the precipitated electrical components to the circuit board, which is the national process index of grade 2 and grade 3. Parts are damaged. The damage of SMT components adds new or clear standards. Such as fracture and chipping. SMT exception. Added related tombstones, * * * * flatness, solder paste reflow, non-wetting, dewetting, disturbed solder, cracked solder, pinhole, blowhole information, tin bridge, solder ball and solder mesh. Added information on the following component types: flat lug lead, high-profile component with only bottom terminal, L-shaped strip lead formed inward, area array or ball grid array component (BGA). In a word, the IPC-A-6 10 D version has an important improvement on the basis of the C version. The members of the Development Committee have carefully identified those recommendations that will clarify key themes and eliminate confusion.

Adopt it