The use, process flow, principle, reagent, plating equipment type, control of process parameters and performance of gold coating.

Gold plating principle

Gold-plated anodes are generally made of platinum mesh and titanium mesh.

When the power supply is applied between the platinum-titanium mesh (anode) and the silicon wafer (cathode), the solution will generate current and form an electric field. The anode carries out oxidation reaction to release electrons, and the cathode obtains electrons for reduction reaction.

Complex alloy ions near the cathode combine with electrons and are deposited on the surface of silicon wafer in the form of gold atoms. Under the action of external electric field, the complex alloy ions in the plating solution move directionally to the cathode to supplement the concentration consumption near the cathode. This is a schematic diagram of horizontal cup plating, and Figure 2 is a schematic diagram of vertical hanging plating.

The main purpose of electroplating is to deposit compact, uniform, hole-free and seamless gold on the silicon wafer.