Choose a copper plate with the thickness of 1mm as the base plate, and clamp it firmly with a fixture after degreasing and cleaning. The fixture divides the copper plate into many small pieces of 24mm× 12mm, and the surface of each small piece is removed after composite electrodeposition of diamond to form a composite part.

Using copper plate as cathode, Ni or Ni-Co metal is deposited by electrifying, and then a layer of diamond (called sanding) is evenly spread on the flat copper plate. After a certain period of deposition at low current density, it is sanded, and then the current density is increased for thickening electroplating. When most or all diamonds are buried by the deposited metal, the fixture is taken out, washed with water, and the deposited composite sheet is removed from the copper plate substrate and dried for later use.

2) Bonding diamond compact by powder metallurgy.

Several kinds of metal powders are selected, mainly low melting point copper powder, supplemented by cheap metal powder. Different materials are used to process stone, and different metal powders and proportions should be selected.

3) Selection of mold loading mode

The die size is 24 mm×12 mm× 9 mm. The original abrasive layer was replaced by diamond compact. The size of each compact is 24mm× 12mm, and its thickness mainly depends on the thickening deposition time and current density in the electroplating process, which is similar to the diameter of diamond abrasive particles used in the compact. The number of assembly layers can be adjusted according to the material of the processed stone. The larger the grain, the fewer the layers.

4) Selection of sintering process

Because low melting point metal powder is mainly used as binder, lower sintering temperature can be adopted, which can reduce the thermal damage of diamond compared with ordinary powder metallurgy sintering method. Cold pressing and vacuum sintering can also be used.