Chinese and English comparison of common SMT terms

Abbreviation

Full English name

Chinese explanation

SMT

Surface Mounted Technology

Surface Mount Technology

SMD

Surface Mount Device

Surface Mount Device (Component) < /p>

DIP

Dual In-line Package

Dual In-line Package

QFP

Quad Flat Package < /p>

Plastic Quad Flat Package

PQFP

Plastic Quad Flat Package

Plastic Quad Flat Package

SQFP < /p>

Shorten Quad Flat Package

Reduced Fine Pitch QFP

BGA

Ball Grid Array Package

Ball Grid Array Package

PGA

Pin Grid Array Package

Pin Grid Array Package

CPGA

Ceramic Pin Grid Array

Ceramic Pin Grid Array Matrix

PLCC

Plastic Leaded Chip Carrier

Plastic Leaded Chip Carrier

CLCC

Ceramic Leaded Chip Carrier

Plastic leadless chip carrier

SOP

Small Outline Package

TSOP

Thin Small Outline Package

Thin Small Outline Package

SOT

Small Outline Transistor

Small Outline Transistor

SOJ

Small Outline J-lead Package

J-shaped lead small outline package

SOIC

Small Outline Integrated Circuit Package

Small Outline Integrated Circuit Package

MCM

Multil Chip Carrier

Multi-chip components

MELF

Cylindrical footless components

D

Diode

Diode

R

Resistor

Resistor

SOC

System On Chip

System-on-Chip

CSP

Chip Size Package

Chip Size Package

COB

Chip On Board

Chip on board

Explanation of basic SMT terms

A

Accuracy: Measurement results and The difference between the target values.

Additive Process: A method of manufacturing PCB conductive wiring by selectively depositing conductive materials (copper, tin, etc.) on the board layer.

Adhesion: Similar to the attraction between molecules.

Aerosol: Liquid or gas particles small enough to become airborne.

Angle of attack: The angle between the screen printing scraper surface and the screen printing plane.

Anisotropic adhesive: A conductive substance whose particles pass current only in the Z-axis direction.

Annular ring: The conductive material around the drilled hole.

Application specific integrated circuit (ASIC): A customer-customized circuit for a specific purpose.

Array: A set of elements, such as solder ball points, arranged in rows and columns.

Artwork (wiring diagram): The conductive wiring diagram of the PCB is used to produce the original photo. It can be produced in any ratio, but it is usually 3:1 or 4:1.

Automated test equipment (ATE automatic test equipment): Equipment designed to automatically analyze functional or static parameters in order to evaluate performance levels, and also for fault isolation.

Automatic optical inspection (AOI): On an automatic system, a camera is used to inspect a model or object.

B

Ball grid array (BGA ball grid array): A packaging form of an integrated circuit whose input and output points are solder balls arranged in a grid pattern on the bottom surface of the component.

Blind via (blind via hole): The conductive connection between the outer layer and the inner layer of the PCB does not continue to the other side of the board.

Bond lift-off: A fault that separates the soldering pins from the pad surface (circuit board substrate).

Bonding agent: An adhesive that bonds single layers to form multi-layer boards.

Bridge: Solder that connects two conductors that should be electrically connected, causing a short circuit.

Buried via: A conductive connection between two or more inner layers of a PCB (i.e., not visible from the outer layers).

C

CAD/CAM system (computer-aided design and manufacturing system): Computer-aided design uses specialized software tools to design printed circuit structures; computer-aided manufacturing combines this design converted into actual products. These systems include large-scale memories for data processing and storage, input for design creation, and output devices for converting stored information into graphics and reports

Capillary action: causing molten Solder is a natural phenomenon in which solder flows against gravity on closely spaced solid surfaces.

Chip on board (COB board chip): A hybrid technology that uses face-up glued chip components, traditionally connected exclusively to the base layer of the circuit board through flying wires.

Circuit tester (circuit tester): A method of testing PCBs during mass production. Includes: bed of needles, component lead footprints, guide probes, internal traces, loading boards, blank boards, and component testing.

Cladding (covering layer): A thin layer of metal foil is bonded to the board layer to form PCB conductive wiring.

Coefficient of the thermal expansion: When the surface temperature of the material increases, the measured material expansion in parts per million (ppm) per degree of temperature

Cold cleaning (Cold cleaning): An organic dissolution process in which liquid contact completes the removal of residue after welding.

Cold solder joint: A welding joint that reflects insufficient wetting. It is characterized by a gray and porous appearance due to insufficient heating or improper cleaning.

Component density: The number of components on the PCB divided by the area of ??the board.

Conductive epoxy (conductive epoxy resin): A polymeric material made by adding metal particles, usually silver, to pass an electric current.

Conductive ink: An adhesive used on thick film materials to form PCB conductive wiring patterns.

Conformal coating: A thin protective coating applied to PCBs that conform to the assembly shape.

Copper foil: a cathode electrolytic material, a thin, continuous metal foil deposited on the base layer of the circuit board, which serves as the conductor of the PCB. It easily adheres to the insulating layer, accepts the printed protective layer, and forms circuit patterns after corrosion.

Copper mirror test: A flux corrosion test that uses a vacuum deposited film on a glass plate.

Cure (baking and curing): changes in the physical properties of materials through chemical reactions or pressure/non-pressure reactions to heat.

Cycle rate: A component placement term used to measure the machine speed from picking up, to positioning on the board and back, also called test speed.

D

Data recorder: A device that measures and collects temperature from a thermocouple attached to the PCB at specific time intervals.

Defect: A component or circuit unit that deviates from normally accepted characteristics.

Delamination: The separation of laminate layers and the separation between laminate layers and conductive covering layers.

Desoldering: disassembling welding components for repair or replacement. Methods include: using soldering tape to absorb tin, vacuum (solder straw) and hot pulling.

Dewetting: The process in which the molten solder is first covered and then withdrawn, leaving irregular residue.

DFM (Design for Manufacturing): A method of producing a product in the most efficient way, taking into account time, cost and available resources.

Dispersant: A chemical added to water to increase its ability to remove particles.

Documentation: Information about an assembly that explains basic design concepts, types and quantities of components and materials, specific manufacturing instructions, and the latest version. Three types are used: prototypes and low-volume runs, standard production lines and/or production quantities, and those government contracts that specify actual graphics.

Downtime: The time when equipment is not producing products due to maintenance or failure.

Durometer: measures the hardness of the rubber or plastic of the scraper blade.

E

Environmental test: A test or series of tests used to determine the external structural, mechanical, and functional integrity of a given component package or assembly. total impact.

Eutectic solders (crystalline solder): Two or more metal alloys with the lowest melting point. When heated, the crystalline alloy changes directly from solid to liquid without melting. After the plastic stage.

F

Fabrication(): The blank board manufacturing process after design and before assembly. The individual processes include lamination, metal addition/subtraction, drilling, electroplating, wiring and clean.

Fiducial (fiducial point): a special mark integrated with the circuit wiring diagram, used for machine vision to find the direction and position of the wiring diagram.

Fillet: The connection formed by solder between the pad and the component pin. That is, solder joints.

Fine-pitch technology (FPT fine pitch technology): The lead center spacing distance of surface mount component packaging is 0.025%26" (0.635mm) or less.

Fixture: A device that connects the PCB to the center of the processing machine.

Flip chip: A leadless structure that generally contains circuit units. Designed to be electrically and mechanically connected to a circuit by means of an appropriate number of solder balls (covered with conductive adhesive) located on its face.

Full liquidus temperature: The temperature level at which solder reaches its maximum liquid state, most suitable for good wetting.

Functional test: simulate the expected operating environment and test the entire assembly of electrical appliances.

G

Golden boy: A component or circuit assembly that has been tested and known to function to technical specifications, used to test other units by comparison.

H

Halide s: Compounds containing fluorine, chlorine, bromine, iodine or astatine. It is the catalyst part of the flux and must be removed due to its corrosive nature.

Hard water: Water containing calcium carbonate and other ions that may accumulate on the interior surfaces of clean equipment and cause blockages.

Hardener (hardener): Chemicals added to the resin to make it solidify in advance, that is, curing agent.

I

In-circuit test: A component-by-component test to verify the placement and orientation of components.

J

Just-in-time (JIT): Minimize inventory by supplying materials and components directly to the production line before going into production.

L

Lead configuration: The conductor extending from the component serves as both a mechanical and electrical connection point.

Line certification (production line confirmation): Confirm that the production line sequence is under control and can produce reliable PCBs as required.

M

Machine vision: One or more cameras, used to help find the component center or improve the component placement accuracy of the system.

Mean time between failure (MTBF): The average statistical time interval between possible operating unit failures is expected, usually calculated in hours, and the results should indicate actual, expected or calculated.

N

Nonwetting: A condition in which solder does not adhere to the metal surface.

Infusible wetness is characterized by visible exposure of the base metal due to contamination of the surface to be welded.

O

Omegameter (Omegameter): A meter used to measure the amount of ions remaining on the surface of a PCB by immersing the assembly in a mixture of alcohol and water with a known high resistivity. mixture, and thereafter, the decrease in resistivity due to ion carryover was measured and recorded.

Open (open circuit): Two electrical connection points (pins and pads) become separated, either because of insufficient solder or because of poor flatness of the connection point pins.

Organic activated (OA organically active): a flux system in which organic acid is used as an activator, water-soluble.

P

Packaging density (assembly density): The number of components (active/passive components, connectors, etc.) placed on the PCB; expressed as low, medium or high.

Photoploter: A basic wiring diagram processing device used to produce original PCB wiring diagrams (usually actual size) on photographic film.

Pick-and-place (pick-and-place equipment): A programmable machine with a robotic arm that picks up components from an automatic feeder and moves them to a fixed point on the PCB with the correct Orientation stickers are placed in the correct location.

Placement equipment: a machine that combines high speed and accurate positioning to place components on PCB. It is divided into three types: SMD mass transfer, X/Y positioning and online transfer system. Can be combined to adapt components to the board design.

R

Reflow soldering: placing surface mount components into solder paste through various stages including: preheating, stabilization/drying, reflow peaking, and cooling To achieve a permanent connection process.

Repair: An action to restore the functionality of a defective assembly.

Repeatability: The process ability to accurately return to the characteristic target. A metric that evaluates processing equipment and its continuity.

Rework: A repetitive process of bringing incorrect assembly back into compliance with specifications or contract requirements.

Rheology: Describes the flow of a liquid, or its viscosity and surface tension properties, such as solder paste.

S

Saponifier: An aqueous solution of organic or inorganic ingredients and additives used to promote the dispersion of rosin and water-soluble fluxes by products such as dispersible cleaners. Clear.

Schematic: A diagram that uses symbols to represent the layout of a circuit, including electrical connections, components, and functions.

Semi-aqueous cleaning (incomplete water cleaning): Technology involving solvent cleaning, hot water flushing and drying cycles.

Shadowing: In infrared reflow soldering, the component body blocks energy from certain areas, causing the temperature to be insufficient to completely melt the solder paste.

Silver chromate test: A qualitative test for the presence of halide ions in RMA flux. (RMA reliability, maintainability and availability)

Slump: The diffusion of solder paste, glue and other materials after the template is screen-printed and before solidification.

Solder bump (solder ball): A spherical solder material bonded to the contact area of ??passive or active components to connect to the circuit pad.

Solderability: The ability of a conductor (pin, pad, or trace) to become wet (become solderable) in order to form a strong connection.

Soldermask: A processing technology for printed circuit boards in which all surfaces except the connection points to be soldered are covered with a plastic coating.

Solids (solids): The weight percentage of rosin in the flux formula, (solids content)

Solidus (solidus): The solder alloy of some components begins to melt (liquefy) temperature.

Statistical process control (SPC): Use statistical techniques to analyze process output and use the results to guide actions, adjust and/or maintain quality control status.

Storage life: The time the glue is stored and remains useful.

Subtractive process (negative process): Obtaining circuit wiring by removing selected parts of the conductive metal foil or covering layer.

Surfactant: A chemical added to water to reduce surface tension and improve wetting.

Syringe: A container of glue that drips through its narrow opening.

T

Tape-and-reel (tape and disk): component packaging for SMT. On a continuous strip, the components are loaded into the pits. The pits are made of Covered with plastic tape so it can be rolled onto a tray for use by a component placement machine.

Thermocouple: A sensor made of two different metals that, when heated, produces a small DC voltage in temperature measurement.

Type I, II, III assembly: PCB (I) with surface mount components on one or both sides of the board; components with pins are installed on the main surface, There are hybrid technologies (II) in which SMD components are mounted on one or both sides; hybrid technologies (III) characterized by passive SMD components being mounted on the second side and pin (through-hole) components being mounted on the main surface.

Tombstoning (component standing up): A welding defect in which the chip component is pulled to a vertical position, leaving the other end unsoldered.

U

Ultra-fine-pitch (Ultra-fine-pitch): The center-to-center distance of the pins and the conductor spacing are 0.010” (0.25mm) or less.

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V

Vapor degreaser: A cleaning system in which objects are suspended in a box and heated solvent vapor condenses on the surface of the object.

Void (void): The void inside the solder point is formed by the release of gas during reflow or the flux residue trapped before solidification.

Y

Yield (yield): the ratio of the number of components used at the end of the manufacturing process to the number of components submitted for production. Download detailed instructions: /view/f4529ac24028915f804dc26d.html