Current location - Plastic Surgery and Aesthetics Network - Plastic surgery and medical aesthetics - The solder joints of QFP components after the lead-free 0.3Ag solder paste furnace are not full enough, and the empty pads are not smooth when melting tin. Is there any effective way to improve it?
The solder joints of QFP components after the lead-free 0.3Ag solder paste furnace are not full enough, and the empty pads are not smooth when melting tin. Is there any effective way to improve it?

Are the results really obtained under the same conditions?

For example, temperature recovery, stirring steel mesh, etc.

High AG content, wetting effect Of course it's better. But it's much more expensive.

Is the same Profile still available?

The Profiles of these two solder pastes should be different.

The same Profile3AG solder paste can produce a good result, indicating that there must be a problem with the Profile.

It is recommended to look for the cause from the Profile aspect. In addition, the flux in the solder paste should also be considered.< /p>

I haven’t been exposed to this aspect for more than two years. If I can’t help you, I suggest you go to SMT Home and ask.