How to strengthen notebook heat dissipation: Step 1: Make composite copper sheet.
Firstly, the composite copper sheet needed for heat dissipation transformation needs 1mm thick pure copper sheet and solid silicone grease. Originally, pure copper sheet and solid silicone grease were combined into a composite pad, which was placed between the heat pipe and the chip to promote the heat transfer between the chip and the heat pipe. But this time, we don't use them to make this composite pad. We only need to stick solid silicone grease on one side of the copper sheet and tear off the adhesive film on the other side of the solid silicone grease to make the composite copper sheet we need. It is mainly used for sticking to the surface of heat pipe to increase the heat dissipation effect of heat pipe. Some netizens may think that the heat pipe is only responsible for transferring the heat from the internal chip to the outside. It is meaningless to do so like the author, but in fact, the heat dissipation effect has really improved.
Step 2: Prepare ice silkworm pure copper radiator.
Prepare another artifact of ours, ice silkworm pure copper radiator, which has obvious cooling effect on chips such as memory and graphics card. This time, the author used it to help the graphics card to dissipate heat. There is a white film on the bottom of it, which will expose the vinyl after tearing. This is a kind of super glue, so just stick it directly to the place where auxiliary heat dissipation is needed.
Step 3: Take it apart and observe the internal structure of the machine.
To begin the disassembly, please pay attention to unscrew all the screws on the back panel before opening the back panel of the notebook. Remember to remove static electricity and take out the battery. After opening the back cover, we observe the internal structure of the notebook to determine which part can be pasted with composite copper sheet or ice silkworm pure copper radiator.
After observing the internal structure of the notebook, we can find several places suitable for sticking heat dissipation copper sheets, which are circled in red in the picture below. The author's notebook uses double heat pipes to dissipate heat. The left heat pipe is responsible for the heat dissipation of the processor (CPU) and the South Bridge chip, and the right heat pipe is responsible for the heat dissipation of the display chip (GPU). Now we are going to stick our "secret weapon" pure copper radiator on the red circle.
Step 4: Paste the pure copper heat sink.
This is the most critical moment. We need to stick the finished composite copper sheet and ice silkworm pure copper radiator in the positions that can be used to the greatest extent, that is, those positions marked in the above picture. In the process of pasting, it should be noted that both the composite copper sheet and the ice silkworm pure copper radiator need to be pressed firmly with fingers, and the super glue of the ice silkworm pure copper radiator may be easily fixed. The solid silicone grease of the composite copper sheet is sticky, but the characteristic of the solid silicone grease is that the viscosity increases after heating, that is, the composite copper sheet can be bonded more firmly after heating, so the composite copper sheet will be pressed here first, and then opened for a period of time, and the composite copper sheet will be bonded more firmly after the temperature of the heat pipe rises.
These are all the steps of this transformation. Close the back cover, and you can feel the wonderful effect brought by the pure copper radiator. Let's briefly analyze why these pure copper heat dissipation copper sheets have such a good effect. First of all, everyone needs to know that notebooks mainly rely on air cooling to dissipate heat, so how to release the temperature inside the fuselage is the key to notebook heat dissipation at normal ambient temperature.
The author's notebook enters the air from the cooling hole at the bottom, exhausts the air from the rear side and the left rear side of the fuselage, and releases the temperature through such a circulating duct. The cooling holes on the bottom surface correspond to CPU and GPU chips, and the heat pipe with pure copper fins can transfer heat to the fins of the air outlet more quickly. In addition, because the air inlet is facing the attached pure copper fin, this is equivalent to accelerating the surface airflow and achieving the effect of cooling.