SMT is a Surface Mount Technology (abbreviation of surface mount technology), and SMT material is a chip-packaged component. It is small in size, does not need to punch holes in the printed board, and is easy to realize automatic production line welding.

DIP package, the abbreviation of dual in-line pin package, is also called dual in-line package technology, which is a common packaging form of traditional integrated circuits. Large size, need to punch holes in the printed board, but also need to reshape the components, suitable for the previous manual welding assembly line. Until now, printed boards are usually inserted by hand and then soldered.

Of course, there are also some special components that need to be punched on the printed board, similar to DIP, but not necessarily in the form of "double-row pins".

For example, SMT packaging materials include chip resistors, chip capacitors, chip integrated circuits and so on.

However, most DIP packages are small-scale integrated circuits, including TTL and high-speed CMOS circuits in 74 series DIP packages.

It should be noted that sometimes, the same circuit logic will be packaged in the form of SMT and DIP respectively. Pay attention to their suffixes, which will contain the packaging logo. For example, TI's 74AHCT08D is SMT package, while its 74AHCT08N is DIP package.