DIP packaging (Dual In-line Package), also called dual in-line packaging technology, refers to integrated circuit chips packaged in dual in-line form. Most small and medium-sized integrated circuits use this A package form, the number of pins generally does not exceed 100. The DIP packaged CPU chip has two rows of pins and needs to be inserted into the chip socket with a DIP structure.

Surface mount technology SMT

Surface mount technology, called "Surface Mount Technology" in English, or SMT for short, is the process of attaching and welding surface mount components to printed circuit boards. The circuit assembly technology at the specified position on the surface of the circuit board, the circuit board used must be drilled without principles. Specifically, solder paste is first applied to the printed circuit board circuit board, and then the surface mount components are accurately placed on the pads coated with solder paste, and the printed circuit board is heated until the solder paste melts and cooled. Then the interconnection between components and printed boards was realized. In the 1980s, SMT production technology became increasingly perfect. Components used in surface mounting technology were mass-produced and prices dropped significantly. Various equipment with good technical performance and low price became available one after another. Electronic products assembled with SMT are small in size. With the advantages of good performance, full functions, and low price, SMT, as a new generation of electronic assembly technology, is widely used in electronic products in various fields such as aviation, aerospace, communications, computers, medical electronics, automobiles, office automation, and household appliances. Assembling in progress.