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What are the processes of Hill Electronics Factory?
Factory inspection of components, molding treatment, SMT mounting and secondary assembly.

1. Factory inspection of components and PCB.

2. Components are molded to facilitate assembly.

3.SMT chip, through reflow soldering, the chip device is installed on the PCB.

4. After manual assembly, wave soldering is carried out, and then welding molding is needed, which is generally called secondary assembly.