The core data of this paper: the cost structure of optical communication devices and the development of high-end optical chip products.
Optical chip is the core component of optical devices.
Optical chips are mainly used for photoelectric signal conversion and follow the packaging order of "chip -OSA- transceiver". Laser chip is made into optical module (transceiver) by traditional to package or emerging multimode COB package. In the optical communication system, the commonly used core optical chips are mainly DFB, EML and VCSEL, which are used in different transmission distances and cost-sensitive application scenarios.
According to their different physical forms, optical communication devices can be generally divided into four categories: chips, optical active devices, optical passive devices, optical modules and subsystems, in which optical chips are an important part of optical devices (optical active devices and optical passive devices) and optical devices are an important part of optical modules.
The production process of optical chips can be basically divided into four processes: chip design, substrate manufacturing, epitaxial growth and grain manufacturing. It can be seen that its technical barriers are high, and its production process is as follows:
Domestic high-speed optical chips have low localization rate.
According to the R&D capability and delivery capability of China optical chips, China optical chip suppliers are divided into three echelons. The first echelon is mainly Huawei Hisilicon, Guangxun Technology and sensitive semiconductors. , and has certain high-end optical chip development ability; In the second echelon, Hisense Broadband, Zhongke Optical Core, Shaanxi Yuan Jie and other enterprises have better shipping capacity of low-end optical chips; The third echelon is other low-speed optical chip manufacturers.
At present, the core technology of high-speed optical chips is mainly in the hands of American and Japanese manufacturers. On October 20 18, 18 10, the Ministry of industry and information technology promulgated the roadmap for the development of optical device industry (20 18-2022), which promoted the localization of optical chips to a national strategy. However, Sino-US trade friction and ZTE's ban on sales may prompt China to increase its support for high-speed optical chips, and the localization process is expected to be further accelerated.
At present, the domestic and international productization capabilities of China's core optical chips and electrical chips are compared as follows:
Domestic high-end optical chips are mostly in the research and development stage.
At present, the upstream optical chips of domestic high-end optical modules are still limited by overseas leading enterprises. Take 100Gb/s 10/40km optical module as an example. At present, most domestic head enterprises are still in the research and development stage, while international leading manufacturers such as SEDI have basically passed the sample stage and achieved mass production.
Development trend of optical chips
Judging from the development trend of China's optical chips and the changes in the market scale of optical chips over the years, China's optical chip industry will continue to develop rapidly in the next five years. Although the competition in the low-end optical chip market is fierce, the industry prospect is good and the policy support is strong. There will still be a large number of enterprises entering the market in the future. With the leading effect of optical module industry becoming more and more obvious, the domestic substitution rate of high-end optical chips in China will also increase steadily.
The above data refer to the Analysis Report on Market Foresight and Investment Strategic Planning of China Optical Module Industry by Forward-looking Industry Research Institute.