Dual in-line package Dual in-line package?
Cdip: ceramic dual in-line package ceramic dual in-line package?
Pdip: plastic dual in-line package plastic dual in-line package?
QFP: square flat package square flat package?
TQFP: Thin quad flat package?
PQFP: Plastic square flat package Plastic square flat package?
MQFP: Metric quad flat package?
VQFP: ultra-thin square flat package?
SOP: low profile package?
Ssop: shrink small form factor package to reduce external package?
TSOP: Thin small form factor package
TSSOP: ultra-thin shrink small form factor package?
QSOP: Quarter Small Package?
VSOP: ultra-small package
TVSOP: very thin and small package?
LCC: leadless ceramic chip carrier
LCCC: Lead-free ceramic chip carrier?
Plcc: Plastic led chip carrier, plastic lead chip carrier package?
BGA: ball grid array ball grid array?
IC packaging refers to connecting the circuit pins on the silicon chip with wires to external connectors so as to connect with other devices. The packaging form refers to the shell used to install the semiconductor integrated circuit chip. It not only plays the role of installing, fixing, sealing, protecting the chip and enhancing the electrothermal performance, but also connects to the pins of the package shell through the contacts on the chip, and these pins are connected to other devices through the wires on the printed circuit board, thus realizing the connection between the internal chip and the external circuit. Because the chip must be isolated from the outside world, to prevent impurities in the air from corroding the chip circuit, resulting in the decline of electrical performance.
kind
BGA(ballgridarray) spherical contact array is a kind of surface mount package. Spherical bumps are made on the back of the printed substrate instead of pins, LSI chips are assembled on the front of the printed substrate, and then sealed with molding resin or potting. Also known as bump display carrier (PAC). There can be more than 200 pins, which is the package of multi-pin LSI. The package can also be made smaller than QFP (quad pin flat package). For example, a 360-lead BGA with a pin center distance of 1.5mm is only 3 1mm square; A 304-pin QFP with a center-to-center distance of 0.5 mm is 40 mm2. And BGA doesn't have to worry about pin deformation like QFP. Developed by Motorola, the software package was first used in portable phones and other devices, and may be popularized in personal computers in the United States in the future. At first, the center distance between the pins (bumps) of BGA was 1.5mm, and the number of pins was 225. Now some LSI manufacturers are developing 500-pin BGA. The problem of BGA is visual inspection after reflow soldering. It is not clear whether this is an effective visual inspection method. Some people think that because of the great distance between welding centers, the connection can be regarded as stable and can only be handled through functional inspection. Motorola Company of the United States calls the package sealed with molding resin OMPAC, and the package sealed with potting method GPAC.
Four-sided pin flat package with buffer pad. One of QFP packages, bumps (buffer pads) are set at the four corners of the package to prevent the pins from bending and deforming during transportation. American semiconductor manufacturers mainly use this package in microprocessor, ASIC and other circuits. The pin center distance is 0.635 mm, and the number of pins ranges from 84 to 196 (see QFP).
Butt pin grid array
Another name for surface mount PGA (see surface mount PGA).