Surface mount technology, namely SMT (abbreviation of surface mount technology), is the most popular technology and process in electronic assembly industry at present. Electronic products have high assembly density, small volume and light weight. The size and weight of the patch component are only about110 of the traditional plug-in. After SMT, the volume of general electronic products is reduced by 40%~60% and the weight is reduced by 60%~80%.
The shape of the integrated circuit is rectangular, and there are two rows of parallel metal pins on both sides, which is called pin arrangement. The components of the DIP package can be soldered in the plated through hole of the printed circuit board or inserted into the DIP socket.
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The innovation of packaging technology has also become a powerful driving force for the sustainable development of semiconductor and electronic manufacturing technology, which has a great impact on the improvement of semiconductor front-end technology and surface mount technology. If the bump generation of flip chip is an extension of the former semiconductor process to the latter package, then the bump generation of silicon wafer based on wire bonding is an extension of the former package technology.
DIP packaging is very popular in the era when memory particles are directly inserted into the motherboard. There is also a derivative of DIP, SDIP, which is 6 times higher than the needle density of DIP.
Baidu Encyclopedia-Surface Mount Technology
Baidu encyclopedia -DIP