IC package loading board is usually a substrate for assembling IC chips and other electronic components. It provides electrical connection and supporting structure, fixes electronic components on the circuit board, and realizes the function of the whole circuit. The main function of the carrier board is to provide electrical connection and mechanical support to ensure the performance and reliability of the circuit.
Packaging mold is a mold tool, which is used to produce the packaging of integrated circuits. It puts the integrated circuit chip into the packaging mold and packages the chip in the shell, which protects the chip and is convenient for installation. The main function of packaging mold is to protect the integrated circuit chip and make it work stably in practical application.
Therefore, IC package loading board and packaging mold are two different concepts and entities, each with different functions and application scenarios.