Dual in-line packaging, also known as dual in-line packaging technology, refers to the packaging of integrated circuit chips in the form of dual in-line. Most small and medium-sized integrated circuits adopt this packaging form, and the number of pins generally does not exceed 100. The CPU chip in DIP package has two rows of pins, which need to be inserted into the chip socket in DIP structure. Of course, it can also be directly inserted into the same number and geometric arrangement of welding holes on the circuit board for welding. DIP packaged chips should be carefully plugged and unplugged from the chip socket to avoid damaging the pins. DIP package structure forms include: multi-layer ceramic DIP, single-layer ceramic DIP, lead frame DIP (including glass-ceramic sealing type, plastic packaging structure, ceramic low melting point glass packaging type) and so on.

For example, VGA interface of computer, VCD DVD, audio interface, signal interface and DVI interface of digital signal. . . . . . hope this helps